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作 者:封纯真[1] 赵守亮[1] 凌伟[2] 亢彦强[1]
机构地区:[1]第四军医大学口腔医学院,陕西西安710032 [2]西安交通大学材料力学系,陕西西安710049
出 处:《牙体牙髓牙周病学杂志》2006年第5期261-263,共3页Chinese Journal of Conservative Dentistry
基 金:陕西科技攻关项目编号2004k16-G4(5)
摘 要:目的:分析复合树脂固化收缩后黏结层的应力变化。方法:建立三维环形有限元模块,分别采用釉质、黏结剂、树脂的材料参数,应用温度应力的原理,模拟树脂固化时产生的体积收缩。分析10GPa、20GPa弹性模量的复合树脂在1%、1.5%、2%、2.5%、3%、3.5%体积收缩率时黏结层的应力分布和变化规律。结果:树脂固化时体积收缩率越大,在黏结层产生的应力越大;树脂的弹性模量越大,黏结层的应力越大。结论:树脂固化时的体积收缩可在黏结层产生较大的应力,影响黏结强度。AIM :To evaluate the stress distribution in adhesive layer induced by polymerization shrinkage of composite resin . METHODS: A disk with enamel, composite resin and adhesive layer was modeled by 3D finite element analysis. The shrinkage was simulated by means of temperature - dependent expansion. The effects of 6 different volumetric shrinkages and 2 different elastic moduli on stress of adhesive layer were analyzed. RESULT: High stress distribution in adhesive layer could be induced by volumetric shrinkage of composite resin. The higher of the volumetric shrinkage ,the higher stress in adhesive layer was produced. Higher elastic modulus led to higher stress distribution in adhesive layer. CONCLUSION: Polymerization shrinkage of composite resin has negative effect on bonding strength of adhesives.
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