热–机械应力和湿气引起QFN器件层间开裂分析  

Analysis on Thermal-mechanical Stress and Moisture Driven Delamination in the QFN Package Devices

作　　者：罗海萍[1] 杨道国[1] 李宇君[1] 

机构地区：[1]桂林电子工业学院,广西桂林541004

出　　处：《电子元件与材料》2006年第6期64-66,70,共4页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(60166001)

摘　　要：采用通用有限元软件分析和计算器件在潮湿环境下的潮湿扩散,并计算由于吸潮使器件在无铅回流的高温下产生蒸汽压力,并对层间开裂现象进行分析。结果表明,气压是层间开裂的主要原因,在气压和热机械应力的作用下,层合面上的微孔洞扩张并结合起来,导致器件最后失效。The finite element analysis on moisture diffusion in microelectronic plastic packages during moisture precondition by using a commercial FEA software was studied and modeled. Then, the vapor stress which induced under lead-free reflow temperature was calculated. And delamination phenomenon appear in package was also analyzed. The results indicate that the vapor pressure is a major driven force for interface delamination. Under vapor and thermo-mechanical stress, the micro holes in the interface start to expand and combine. Finally, it induced delamination.

关 键 词：电子技术 QFN封装 潮湿扩散 无铅焊 气压 层间开裂 

分 类 号：TN40[电子电信—微电子学与固体电子学]