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机构地区:[1]成都口腔医学院口腔修复教研室,河北医学院口腔系
出 处:《华西医科大学学报》1996年第1期85-89,共5页Journal of West China University of Medical Sciences
基 金:国家自然科学基金
摘 要:本实验对Plat铸造陶瓷(PCC)和SDA-Ⅱ型中熔合金采用不同的表面处理和3种粘接剂粘接,并结合扫描电镜现实及X线能谱分析,考查其抗张粘接强度(TBS),以选出最佳粘接剂及其界面处理方式。结果表明:①TF粘接剂在本实验中粘接性能最好。②当使用TF粘接剂,陶瓷表面用氢氟酸处理,合金表面用KH-570涂布时,TBS最大,为24.37MPa;当使用EM粘接剂,陶瓷表面用氢氟酸处理,合金表面喷砂时,TBS较大,为15.20MPa;而使用Porcelitedualcurecement粘接剂,陶瓷表面涂布KH-570,合金表面喷砂时,TBS较大,为15.25MPa。Plat castable ceramics(PCC)was bon-ded to SDA-Ⅱ mild fusing alloy using three bondingagents,and the tensile bond strengths were tested re-spectively in order to select the best bonding agent andthe best way of surface treatment. The results ob-tained with scanning electron microscope and X-rayenergy spectrum showed that the bonding behavior ofTF agent was the best one. The greatest tensille bondstrength(24.37 MPa)was obtained with TF agentwhen the surface of PCC was etched by hydrofoluoricacid and the alloy was painted with KH-570.Remark-able tensile bond strengths were noted in the groupwhere EM agent was used with PCC etched by hy-drofluoric acid and alloy treated with sandblasting(15. 20 MPa),and in the group where porcelite dualcure cement was applied with PCC painted by KH-570and alloy treated with sandblasting (15. 25 MPa).
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