电子封装用高体积分数SiCp／Al复合材料的制备  

Preparation of high volume fraction SiCp/Al composites for electronic packaging

作　　者：任淑彬[1] 何新波[1] 曲选辉[1] 叶斌[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《北京科技大学学报》2006年第5期444-447,共4页Journal of University of Science and Technology Beijing

基　　金：国家自然科学基金资助项目(No.50274014)

摘　　要：采用粉末注射成形制备SiC预成形坯和Al合金无压熔渗相结合的工艺,用单一粒度的粉末成功地制备出了致密度为98．7％的60％SiCp／Al高体积分数复合材料．SEM分析表明,所制备的复合材料增强体和基体分布均匀,组织致密,热膨胀系数在100℃到400℃范围内介于(7．10- 7．75)×10-6K-1之间,室温热导率为170W·m-1·K-1,能够完全满足电子封装的技术要求．60 % SiCp/Al composites with a relative density of 98.7 % were successfully prepared by the combination of ceramic injection molding for the preparation of SiC preforms with monosized particles and aluminum pressureless infiltration technique. The composites＇ microstructures were uniform and dense observed by SEM. The coefficients of thermal expansion of the composites in the current work ranged from 7.10 × 10^-6 to 7.75 × 10^-6 K^-1 as the temperature from 100 ℃ to 400 ℃, and the thermal conductivity was 170 W·m^-1. K^-1. Both were suit the technique requirement for electronic packaging.

关 键 词：SICP/AL复合材料 电子封装 注射成形 无压熔渗 

分 类 号：TB333[一般工业技术—材料科学与工程]