电铸制备铜-石墨复合材料的研究  

Investigation on Cu-graphite Composites Prepared by Electroforming

作　　者：赵海军[1] 刘磊[1] 唐谊平[1] 朱建华[1] 胡文彬[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室,上海200030

出　　处：《材料工程》2006年第5期12-15,共4页Journal of Materials Engineering

基　　金：国家高技术研究发展计划("863"计划)项目(2002AA334010);上海市科委重点新材料项目(035211037);上海市科技发展基金项目(0211nm052)

摘　　要：在酸性硫酸铜溶液中采用电铸技术制备了铜石墨复合材料。表面活性剂、微粒浓度、电流密度和搅拌速度等工艺条件对微粒含量具有不同的影响。非离子表面活性剂对微粒共沉积具有较好的效果;随着微粒浓度增大,微粒含量也逐渐增大,最后趋于稳定值;电流密度增大使微粒含量降低;搅拌速度增大时微粒含量存在最大值。铜石墨复合材料的硬度和摩擦系数随着微粒含量增大而减小,但是磨损量先是减小而后增大。摩擦过程中纯铜发生粘着磨损,铜石墨复合材料却表现为剥层磨损。Cu-graphite composites were prepared by electroforming technology in an acidic copper sulfate solution. The processing factors, such as surfactant, particle concentration, current density, agitation rate, had different effect on the volume fraction of graphite particles in the composites. Non-ionic surfactant improved the codeposition of graphite particles with copper matrix. With increasing graphite content in Cu-graphite composites, microhardness and friction coefficient decreased. However, wear mass loss decreased at the beginning, and then increased. During friction process adhesive wear occurred for pure copper, but delaminating wear occurred for Cu-graphite composites.

关 键 词：电铸 铜-石墨 金属基复合材料 摩擦 磨损 

分 类 号：TB331[一般工业技术—材料科学与工程]