电子塑封用脂环族环氧树脂研究进展  

Research advancess of alicyclic epoxy for electronic encapsulate materials

作　　者：张小华[1] 张志森[1] 徐伟箭[1] 熊远钦[1] 

机构地区：[1]湖南大学化学化工学院,湖南长沙410082

出　　处：《热固性树脂》2006年第3期47-49,53,共4页Thermosetting Resin

基　　金：湖南省自然科学基金资助项目(05JJ30146)

摘　　要：结合电子封装的现状、电子塑封材料的发展以及电子封装对塑封材料提出的高性能要求,介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景,其包括耐热型液体、含磷三官能团型、有机硅多官能团脂环族环氧树脂。同时简略介绍了脂环族环氧树脂增韧改性研究动向。In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs. It included the heat - resistant liquid alicyclic epoxy, the trifunctional alicyclic epoxy cotaining phosphorus in molecular chain, polyfunctional alicyclic epoxy resin containing silicon in molecular chain and its trends of toughnening modification was simply described.

关 键 词：电子封装 电子塑封材料 脂环族环氧树脂 环氧化 

分 类 号：TQ3223.5[化学工程—合成树脂塑料工业]