固结磨料抛光垫作用下的材料去除速率模型  

A model of material removal rate with fixed abrasive pad

作　　者：朱永伟[1] 何建桥[1] 

机构地区：[1]南京航空航天大学机电学院,江苏南京210016

出　　处：《金刚石与磨料磨具工程》2006年第3期38-41,45,共5页Diamond & Abrasives Engineering

摘　　要：在对研磨抛光过程作出适当简化的基础上,推导出了固结磨料研具研磨抛光工件的去除速率模型,并进行了数值模拟。结果表明:固结磨料研磨加工时的去除速率不仅与工件的材质有关,还与固结磨料研磨盘的结构与加工参数相关;去除速率与相对速度V成正比,与压力的3/2次方成正比,与磨料直径成反比,并随着凸起间距的增加而下降。A model based on appropriate simplification was developed for describing material removal rate with fixed abrasive pad during wafer polishing, and a numerical simulation of material removal rate was conducted. The results showed that the material removal rate is related to material of parts, structure of pad and machining parameters. It is proportional to relative velocity between pad and parts and is inverse to the diameter of the abrasive grits. The dependence of applied pressure is found to be nonlinear. The material removal rate decreases with the increase of the distance between asperities.

关 键 词：固结磨料 抛光 去除速率 模型 

分 类 号：TG74[金属学及工艺—刀具与模具]