电子材料用球形超细银粉的制备  

Production of Ultrafine Global Silver Powder Applied in Electronic Materials

作　　者：梁敏[1] 唐霁楠[1] 林保平[1] 

机构地区：[1]东南大学化学系纳米与电子材料研究室,南京210096

出　　处：《中国粉体技术》2006年第3期16-19,47,共5页China Powder Science and Technology

摘　　要：采用化学还原法,以抗坏血酸为还原剂,油酸为分散剂,将硝酸银溶液滴加到还原性溶液中制备电子材料用球形高纯超细银粉。对还原机理进行了分析,探讨了还原过程中各种因素如硝酸银溶液浓度、还原剂浓度、pH值、搅拌方式及速率以及反应温度等对银粉粒度大小及分布的影响。采用TEM、SEM、EDAX和XRD对所得银粉进行了表征。结果表明,通过改变反应条件可制备0.3￣1.0μm的不同粒径的球形高纯超细银粉。Global ultrafine silver powder was prepared by reducing the silver nitrate with ascorbic acid under the presence of oleic acid dispersant, and the reduction mechanism was analyzed. The influence of silver nitrate concentration, reducing agent concentration, pH value, stirring rate and reaction temperature on diameter of silver particles and particle distribution was studied. The silver powder was characterized by TEM ,SEM ,EDAX and XRD. The results indicate highly pure global silver powder with the particle diameters between 0.3 μ m and 1.0 μm could be prepared by adjusting the reaction condition.

关 键 词：电子材料 超细银粉 化学还原 

分 类 号：TB383[一般工业技术—材料科学与工程] TF123.121[冶金工程—粉末冶金]