有机硅改性环氧树脂耐热胶粘剂的研制  

Study on Organosilicon Modified Epoxy Resin Adhesive for Heat-resistance

作　　者：张顺[1] 谢建良[1] 邓龙江[1] 

机构地区：[1]电子科技大学微电子与固体电子学院,成都610054

出　　处：《材料导报》2006年第F05期54-56,共3页Materials Reports

基　　金：武器装备预研基金项目(5141001020DZ02)

摘　　要：用有机硅活性中间体对环氧树脂E44进行接枝共聚改性,得到一种具有良好耐热性和机械性能的新型改性树脂,研究了催化剂种类、原料配比、反应温度和时间对产物的影响。以自制芳香胺为固化剂,添加一定量的纳米TiO2和丁腈橡胶,制得的胶粘剂在30℃、7天基本固化完全,250℃热老化100h后,仍有15.3MPa的剪切强度。并用FT-IR、DSC、TGA等手段对产物进行了表征和分析。A heat-resistant modified epoxy resin with good mechanical properties is prepared by condensation polymerization of epoxy resin （FA4） and silicone intermediate. The influences of catalyst, stoichiometric composition, reaction temperature and time on the properties of production are investigated. The adhesive prepared by use of synthesized curing agent, modified epoxy resins as adhesive system and adding nano-TiO2 and butadiene nitrile rubber, can be cured at 30℃ in 7 days. Its shearing strength could reach 15. 3MPa after 250℃/100 h heat-aging. The modified resin is analyzed and characterized by means of FT-IR, DSC and TGA.

关 键 词：环氧树脂 有机硅 耐热 胶粘剂 

分 类 号：TQ638[化学工程—精细化工] TQ436.9