印刷电路板酸性光亮镀铜的研究  

Bright Acid Copper Plating on Printed Circuit Board

作　　者：邓文[1] 刘昭林[1] 郭鹤桐 

机构地区：[1]湘潭矿业学院化工系,天津大学应用化学系

出　　处：《电镀与涂饰》1996年第3期4-8,共5页Electroplating & Finishing

摘　　要：采用１２８６电化学接口及旋转圆盘电极测定了硫酸铜镀液阴极极化曲线和循环伏安曲线。结果表明，Ｃｌ－有增大阴极极化的作用。同时还测定了含ＴＤＹ添加剂镀液的深镀能力和分散能力，其分散能力为９２％，深镀能力为４１．３ｍｍ，镀液寿命达３３４Ａ·ｈ／Ｌ。镀层光亮，结晶细致均匀。Cathodic polarization curve and cyclic voltammetric curve of sulfate copper plating solution are determined with 1286 electrochemical interface and rotating disc electrode.Throwing power and covering power of the plating solution are also measured. The results show that addition of Cl- may increase cathodic polarization, throwing power of the plating solution containing TDY additive is 92%, covering power is 41.3mm, bath life is above 334A·h/L and crystal of the bright copper deposit is fine and uniform.

关 键 词：镀铜 硫酸铜 印刷电路板 电镀 

分 类 号：TN420.5[电子电信—微电子学与固体电子学] TQ153.14[化学工程—电化学工业]