激光收发器件硅基平台封装设计与工艺实现  

Realization of SiOB Packaging Design and Processing of Laser Transmitter and Receiver

作　　者：赵军良[1] 薛中会[1] 关荣锋[1] 王学立[1] 

机构地区：[1]河南理工大学,河南焦作454000

出　　处：《河南大学学报（自然科学版）》2006年第2期29-33,共5页Journal of Henan University:Natural Science

基　　金：国家863计划项目(批准号:2002AA312280)

摘　　要：分析了光电子器件对V型槽刻蚀工艺精度的要求,计算了激光二级管(LD)与光纤直接耦合时所容许的对准容差,给出了无源对准封装工艺对设备和工艺控制精度的要求,并采用贴片精度达±1μm的自动贴片倒装焊工艺和硅V型槽定位技术开发了一种激光收发器件模块.初步的封装试验和测试证明了硅基平台无源对准封装工艺的可行性和可靠性.The precise requirements of silicon anisotropic etching for manufacturing SiOB are analyzed. The alignment tolerances of optical coupling between LD and fiber are computed. The processing equipments for passive alignment and its control precision are given. A laser transmitter and receiver are developed using the automated flip chip bonder with ± 1 μm and V-groove technology. The feasibility and reliability of the passive aligning silicon optical bench are proved by the packaging experiments and test.

关 键 词：光收发器件 硅基平台 封装 无源对准 光耦合 

分 类 号：TN2[电子电信—物理电子学]