电子封装材料表面化学制备高导电率聚吡咯薄膜的研究  

Chemical synthesis of high electrical conductivity polypyrrole film on the surface of electronic packaging materials

作　　者：沈腊珍[1] 胡明[1] 古美良[1] 

机构地区：[1]天津大学电子信息工程学院,天津300072

出　　处：《功能材料》2006年第7期1051-1053,共3页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(60071027);天津市自然科学基金资助项目(023603811)

摘　　要：研究了在环氧树脂塑料封装材料表面制备导电聚吡咯(PPy)薄膜的化学聚合方法,分析了影响聚吡咯薄膜微观形貌、附着力及电导率的因素。用四探针法测聚吡咯薄膜的电导率,并用扫描电子显微镜(SEM)、红外光谱(IR)、X射线光电子能谱(XPS)进行了表征。通过对电子封装材料的表面预处理与改性,制得了附着性好、均匀连续的聚吡咯薄膜,经掺杂电导率达到了45.10S/cm。Polypyrrole film was prepared on the surface of epoxy resin plastic electronic packaging materials by chemical polymerization method. Effect factors of micro-morphology, adhesion and conductivity of polypyrrole film were analyzed. The conductivity of PPy film was measured by the four-point probe method and the samples were characterized by scanning electron microscopy （SEM）, infrared spectrum （IR） and X-ray photoelectron spectroscopy （XPS）. A homogeneous and compact polypyrrole film was obtained through pretreatment and mod- ification by surfactant to the surface of electronic packaging,and the conductivity got to 45.10S/cm by doping.

关 键 词：聚吡咯薄膜 电子封装材料 化学聚合 

分 类 号：TM273[一般工业技术—材料科学与工程]