压电薄膜微传感器振动模态的仿真分析  

THE VIBRATION MODAL ANALYSIS OF PIEZOELECTRIC THIN FILM MICROSENSOR

作　　者：娄利飞[1] 杨银堂[1] 樊永祥[1] 李跃进[1] 

机构地区：[1]西安电子科技大学微电子所宽禁带半导体材料与器件教育部重点试验室,西安710071

出　　处：《振动与冲击》2006年第4期165-169,共5页Journal of Vibration and Shock

基　　金：国家自然科学基金资助项目(90207022);武器装备预研基金项目(51411040105DZ0141)

摘　　要：以压电本构方程为基础,建立了压电薄膜微传感器机电耦合的有限元模型,采用有限元分析软件ANSYS7.0对压电薄膜微传感器进行了模态分析,同时分析了压电薄膜微传感器的结构尺寸对振动模态的影响,探讨了影响压电薄膜微传感器工作稳定性和响应速度的关键因素,结果表明为了提高压电薄膜微传感器的工作稳定性和响应速度,应该在符合工艺要求和保证其它特性的前提下,尽量减小微悬臂梁结构长度,增加多晶硅层厚度,限制PZT层厚度,而微悬臂梁宽度的影响较小。Based on piezoelectric constitutive equation,a finite element model of piezoelectric thin film microsensor is established.By using the finite element software ANSYS7.0,its modal analysis is implemented,and the influence of structural size of piezoelectric thin film microsensor on vibration modes are analyzed,and some key factors that have an effect on the performance of this microsensor are explored.These results indicate that in order to improve work stability and response speed of piezoelectric thim film microsensor we should minimize the length of micro-cantilever beam structure,increase the thickness of polysilicon layer and restrict the thickness of PZT layer with the prerequisite for satisfying technical requirements and ensuring other characteristics,but the influence of width of micro-cantilever beam is less.

关 键 词：压电薄膜 有限元分析 耦合场 微传感器 模态分析 

分 类 号：TN304.055[电子电信—物理电子学]