先进的芯片尺寸封装(CSP)技术  

Advanced Chip Scale Package Technology

作　　者：杜润 

机构地区：[1]半导体行业协会封装分会,北京100083

出　　处：《电子工业专用设备》2006年第9期36-42,共7页Equipment for Electronic Products Manufacturing

摘　　要：随着手机、掌上电脑、薄形笔记本等消费类电子产品的迅速发展,芯片尺寸封装技术(CSP)在我国从无到有,并在短短几年时间内取得了突飞猛进的发展。论述了芯片尺寸封装(CSP)的7大特点,总结了6大类别,归纳了主要生产制作工艺,并对我国芯片尺寸封装技术(CSP)的发展提出了几点建议。with the development of mobile telephone, PDA and lamellar notebook PC, the great development of Chip Scale Package Technology has been occurred in our country recently. In this article, introduces 7 characteristics, 6 sorts and mainly manufacturing approaches of CSP, and give advice on the development of CSP on our country.

关 键 词：芯片尺寸封装 LSI芯片 凸点 

分 类 号：TN305.94[电子电信—物理电子学]