一种装配半导体激光器的新方法  

A Novel Method to Assemble Semiconductor Lasers

作　　者：王玉霞[1] 高欣[1] 

机构地区：[1]长春光机学院重点实验室

出　　处：《长春光学精密机械学院学报》1996年第4期50-52,共3页Journal of Changchun Institute of Optics and Fine Mechanics

摘　　要：本文介绍了在制作半导体激光器的过程中,用热压球焊的方法代替电极压触的方法,减小了激光器的接触电阻,使激光器的阈值电流下降,输出功率提高。Method of heat pressing-ball bonding instead of the electrode pressing contract method in the process of assembling the semiconductor lasers is introduced in this paper.Contact resistance of the lasers was reduced,threshold current of the lasers was reduced and output power of the lasers enhanced.

关 键 词：热压球焊 半导体激光器 接触电阻 装配工艺 

分 类 号：TN248.4[电子电信—物理电子学]