有图形硅片显微图像微距线宽测量方法研究  

Study on the micro width measurement method for graphics wafer

作　　者：王桂棠[1] 薛向东[1] 吴黎明[1] 

机构地区：[1]广东工业大学信息工程学院,广州510006

出　　处：《仪器仪表学报》2006年第9期1138-1140,共3页Chinese Journal of Scientific Instrument

基　　金：广东省科技计划(2004A10403008)资助项目

摘　　要：针对硅片关键尺寸高精度准确测量的要求,在整像素级标准件法二维图像微距尺寸测量的基础上,本文综合应用基于卡尺的标准件法和空间矩亚像素细分算法,提出了具有像素级高速度、亚像素级高精度线宽测量的两步标定法。通过给出一个焊盘样本的实际测量结果来分析对比,表明该方法测量精度有了明显地提高,可以用来进行有图形硅片关键尺寸的测量标定。Due to the high precision measurement requirement for the CMOS chip line width, a two step calibration method is presented, based on the standard component method in the 2-D image micro width measurement. This method includes pixel level high speed and sub-pixel level high precision line width measurements, and makes use of the standard component method of the caliper and the spatial moment sub-pixel subdivision algorithm. The proposed method features high speed and high precision. From analyzing and comparing the experimental results for a welding plate image, it is shown that the method obviously improves the measurement precision, and can be used in the CD calibration of the graphics wafer.

关 键 词：硅片 标准件 像素当量 空间矩 亚像素 标定 

分 类 号：TN4[电子电信—微电子学与固体电子学]