铜片封装光纤光栅传感器的应变和温度传感特性研究  

Study on the Strain and Temperature Densing Characterist ics of FBG Packaged by the Copper slice

作　　者：于秀娟[1] 余有龙[1] 张敏[2] 廖延彪[2] 赖淑蓉[2] 

机构地区：[1]黑龙江大学光纤技术研究所,哈尔滨150080 [2]清华大学电子工程系光纤传感实验室,北京100083

出　　处：《光子学报》2006年第9期1325-1328,共4页Acta Photonica Sinica

基　　金：国家自然科学基金与中国节能投资公司联合研究基金(60177029);国家863高技术计划(2001AA60201111)资助

摘　　要：提出了一种光纤光栅的铜片封装工艺,并通过实验和理论分析研究了光纤光栅的应变和温度传感特性.与裸光纤光栅的测试结果相比,铜片封装工艺基本不改变光纤光栅应变传感的灵敏度,但是温度灵敏度系数提高了2.78倍.经过铜片封装后的光纤光栅可以探测到的应变和温度分别为1με和0.03℃,便于工程应用.In this paper, the copper slice packaging technique for FBG sensor was developed in consideration of bare optical fiber being fragility,and then the strain and temperature characteristics of the packaged FBG sensor were experimentally and theoretically studied. Compared with the experimental results of the bare FBG, the strain sensing property of the FBG sensor packaged by the copper slice is nearly the same as that of the bare FBG, however the temperature sensing ability of the packaged FBG sensor is improved and the temperature sensitivity coefficient is 2. 78 times as much as that of the bare FBG. The strain and temperature resolution of the packaged FBG sensor are 1 μs and 0.03 ℃. The packaged FBG sensors can be used easily in engineering.

关 键 词：光纤BRAGG光栅 封装工艺 应变传感 温度传感 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]