液态锡焊料常见元素氧化的热力学分析  

Thermodynamic Analysis on the Oxidation Reaction of Familiar Elements in Melting Tin-Solder Alloy

作　　者：甘贵生[1] 杜长华[1] 陈方[1] 王卫生[1] 

机构地区：[1]重庆工学院材料科学与工程学院,重庆400050

出　　处：《重庆工学院学报》2006年第8期60-62,共3页Journal of Chongqing Institute of Technology

基　　金：重庆市科委2005年重点自然科学基金资助项目

摘　　要：计算了液态锡焊料中常见元素氧化物生成的标准吉布斯函数随温度的变化关系,绘制了相关氧化反应的ΔGTθ-T图.研究表明,在液态Sn-Pb焊料和Sn-Ag-Cu,Sn-Cu无铅焊料的氧化过程中,对Sn的氧化而言,其表层分子会生成SnO2,在表层分子以下则可能生成SnO;对于Pb的氧化而言,主要生成PbO;而Ag、Cu的氧化物主要是Cu2O和Ag2O.液态锡焊料中所涉及的元素与氧化合的能力依次为:Al>Ga>Zn>ln>Ge>Sn>Fe>Sb>As>Pb>Bi>Cu>Ag.指出,当大量加入与氧化合能力较Sn强的元素作为焊料合金组分时,将会降低其在液态下的抗氧化能力;反之,则可使它的抗氧化性能得到改善.This paper calculates relationship of changes of the standard Gibbis function about the oxidation reaction of familiar elements changes with temperature in melting Tin-solder alloy and draws a chart of △G^θT- T about correlation elements＇ oxidation in this alloy. The research shows that tin will produce SnO2 in solder＇s surface layer, following probably produce SnO , during oxidizing process of liquid Sn-Pb solders and Sn-Ag-Cu,Sn-Cu solders, lead mainly produces PbO, but the oxidation of silver and copper mainly are Ag2O and Cu2O. The oxidation ability with elements in Sn-solder is successively： Al 〉 Ga 〉 Zn 〉 In 〉 Ge 〉 Sn 〉 Fe 〉 Sb 〉 As 〉 Pb 〉 Bi 〉 Cu 〉 Ag. Therefore, the antioxidation property of liquid solder would be lower if choosing elements whose ability combining with oxygen are better than tin as alloying ingredient, and in turn, it can raise the antioxidation property of Sn-solder.

关 键 词：锡焊料 氧化 热力学 △^θT-T图 

分 类 号：TG425.1[金属学及工艺—焊接]