Ag-Cu-Sn-In中温焊膏的性能与初步应用试验  

Performance of Ag-Cu-Sn-In Alloy Solder Paste at Middle Temperature and Its Application

作　　者：涂传政[1] 叶建军[1] 谭澄宇[2] 岳译新[2] 

机构地区：[1]南京电子器件研究所,江苏南京210016 [2]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《热加工工艺》2006年第19期43-45,共3页Hot Working Technology

基　　金：民口配套项目(MKPT04-106)

摘　　要：采用氮气雾化法将Ag-22.4Cu-15Sn-5In焊料制成粉体,利用丙烯酸酯类化合物为载体将其调配成膏状焊料。应用试验表明,所配制的新型焊膏易于涂布,焊接性能良好,焊后残渣少,无需再清洗。该新型焊膏能进行可伐与钨铜、可伐与陶瓷等材料的焊接,有着广阔的应用前景。钎焊界面分析发现,钎料主要是由富Ag相,少量Cu7In4相、Cu39Sn11相以及Cu3Sn相组成。在钎焊过程中,镍基板上的镍与钎料中的元素铜存在元素扩散,这对改善钎料与基体之间的结合状况是有益的。The Ag-22.4Cu-15Sn-5In alloy solder paste was prepared by the atomized solder powder with acrylate and other organic matter. The application tests confirme that the solder paste coats easily,the welding property is good, and after braze welding, it needn＇t clean on the welding position. The solder paste may be adaptable to bond kovar and W-Cu materials, kovar and ceramics etc. The analysis on the cross-section of the brazing sheet shows that the solder alloy is composed of rich Ag phase,less Cu7In4 phase,Cu39,Sn11 phase and Cu3Sn phase. Copper from the solder would interdiffuse with nickel from matrix during braze welding, which might be favorable for bonding brazing metal.

关 键 词：Ag-Cu-Sn-In合金 中温焊膏 润湿性 界面 

分 类 号：TG425.2[金属学及工艺—焊接]