酸性镀铜镀液中氯离子的分析测定及调整方法  

Analytical determination and adjustment of chloride ion in acid copper plating bath

作　　者：董强[1] 欧阳贵[1] 

机构地区：[1]武汉材料保护研究所,武汉430030

出　　处：《电镀与涂饰》2006年第10期56-58,共3页Electroplating & Finishing

摘　　要：概括了酸性镀铜液中氯离子的多种分析测试方法,包括络合滴定法、硝酸汞滴定法、比浊法、离子色谱法和共振散射光谱法等。对实际生产中常用的氯离子的调整方法总结如下:当C l-含量偏低时,可以通过加入氯化钠、盐酸或氯化铜补充;当C l-过量时,则可以加入硝酸银或硫酸银去除。Many kinds of determination methods of chloride ion including eomplexometric titration, mercury nitrate titration, nephelometry, ion chromatography and Resonance Light Scattering etc, were generalized. Common adjustment methods of chloride ion during practical production were summarized as follows： sodium chloride, hydrochloric acid or copper chloride are added to the bath while the content of Clˉ ion is low and the excess Clˉ ion can be gotten rid of by the addition of silver nitrate or silver sulphate.

关 键 词：镀铜 酸性镀液 氯离子 测定 调整 

分 类 号：TQ153.14[化学工程—电化学工业]