线性电机在高速粘片机芯片拾放机构中的应用  

Application of Linear Motor:Picking and Placement Mechanism in High-speed Die Bonder

作　　者：郭强生[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京东燕郊101601

出　　处：《电子工业专用设备》2006年第10期44-48,72,共6页Equipment for Electronic Products Manufacturing

摘　　要：论述了高速粘片机核心部件芯片拾放机构的工作原理以及美国SMAC线性电机的特性,采用线性电机驱动芯片拾放机构,实现了对芯片的高速、高精度和柔性拾放技术。The author illustrates the working principle of chip Picking and Placement Mechanism （PPM）-the core module in high-speed Die Bonder, and the characteristics of American SMAC linear motor. By the application of the linear motor on chip PPM, the technology, chip＇s high speed, high precision and soft picking and placement control, is achieved.

关 键 词：高速粘片机 线性电机 柔性拾放 

分 类 号：TM359.4[电气工程—电机]