CO_2激光直写结合湿法刻蚀加工玻璃基微流控芯片  

Fabrication of Glass Microfluidic Chip by Laser Direct Writing and Wet Etching

作　　者：刘晓清[1] 郝苇苇[1] 高巍巍[1] 周勇亮[1] 

机构地区：[1]厦门大学化学化工学院化学系

出　　处：《传感技术学报》2006年第05B期2038-2040,共3页Chinese Journal of Sensors and Actuators

基　　金：福建省科技重点项目资助(2003H86);留学回国人员启动基金资助

摘　　要：玻璃是制作微流控芯片的重要材料,其加工工艺主要基于光刻后湿法腐蚀,对设备和实验室要求较高.本文提出以普通指甲油和指甲油/金/铬为牺牲层,利用CO2激光烧蚀开窗口,辅以湿法腐蚀加工玻璃基微流控芯片的方法,并考察了激光加工参数,腐蚀液组成,牺牲层等因素对芯片质量的影响.该方法简便易行,不需要光刻的昂贵设备和繁杂步骤.Glass chips fabricated by photolithography and wet etching was popularly used in the mierofluidic field. A method was developed to fast fabricate glass chip avoid photolithography. The enamel and enamel/Au/Cr film were used as sacrificial layer, then the development of pattern carded out by CO2 laser before wet etching. The effect of parameter of CO2 laser, etching solution and sacrificial layer were evaluated.

关 键 词：微流控芯片 制作 CO2激光 湿法腐蚀 

分 类 号：TN405[电子电信—微电子学与固体电子学]