系统级设计方法及其在力学特性集成测试中的应用  

System-Level Design Methodology and Application in Integrated Testing System

作　　者：关乐[1] 褚金奎[1] 王晓东[1] 张段芹[1] 王立鼎[1] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室

出　　处：《传感技术学报》2006年第05A期1313-1318,共6页Chinese Journal of Sensors and Actuators

基　　金：国家自然科学基金资助(50535030)

摘　　要：随着对微尺度下MEMS材料力学特性研究的深入,片上集成测试方法应用愈加广泛.针对MEMS系统具有多能量域耦合的特点,应用基于MEMS宏模型技术的系统级设计工具来获得整个系统的行为特性已成为研究热点.概述了几种建立MEMS宏模型的基本方法,并对其中的节点法进行了详细阐述,利用Coventor Ware软件设计了一种测试多晶硅杨氏模量的集成测试结构,首次将系统级设计方法引入集成测试结构的设计,提高了设计效率,仿真结果可靠.The methods of on-chip integrated testing have a wide application with the development of the study of MicroElectroMechanical System（MEMS） materials mechanical testing in microscale. System-level simulation methods based on macromodel have became a famous research field which can get behavior characteristic of MEMS fast and accurately even if most of MEMS are across multiple coupled energy domains. This paper summarized several essential methods for generating macromodel, especially introduced NODAS method detailedly. An on-chip testing system for Young modules of polisilicon is designed and simulated using CoventorWare. This method can improve efficiency and the simulation results are reliable.

关 键 词：系统级设计 宏模型 集成测试 杨氏模量 

分 类 号：TB302.3[一般工业技术—材料科学与工程] TP391.9[自动化与计算机技术—计算机应用技术]