V型微通道热沉的流体流动与传热问题研究  

Research on Fluid Flow and Heat Transfer of the V-Shaped Microchannel Heat Sink

作　　者：刘婷婷[1] 高杨[2] 韩宾[1] 胡莉[1] 

机构地区：[1]西南科技大学信息与控制工程学院,四川绵阳621010 [2]中国工程物理研究院电子工程研究所,四川绵阳621900

出　　处：《传感技术学报》2006年第05A期1683-1685,共3页Chinese Journal of Sensors and Actuators

基　　金：国防基础研究项目资助(K1303060115)

摘　　要：V型微通道热沉具有体积小、流速小、散热效率高等优点,是将多个DL线阵组装为面阵并实现高性能冷却封装的良好解决方案.本文采用计算流体力学软件Fluent建立了V型微通道的数值模型,研究了其中的流体流动与传热问题.仿真结果表明,设计的V型微通道可满足激光二极管线阵的散热要求.仿真分析结果与V型微通道热沉样品的模拟热源加载实验测试数据对比,吻合较好,证明了数值仿真的有效性.V-shaped microchannel has the advantages of small volume, low flow velocity and high efficiency. V-shaped microchannel is a cooling scheme which assembled multi diode laser bars into an array to achieve high performance cooling package. The paper adopted fluent software to set up a numerical model of V shaped microchannel and researched the fluid and heat transfer of the V-shaped microchannel. The simulation results have been proved to be that V-shaped microchannel can improve the heat dissipation ability of the diode laser arrays. The experiment of the simulated load addition of thermal source has been carried out and tested the cooling performance of V-shaped microchannel with the V-shaped microchannel sample. The experimental data is agreed well with the simulation result and proves the validity of simulation result.

关 键 词：微电子机械系统 V型微通道 热沉 

分 类 号：TK124[动力工程及工程热物理—工程热物理]