液晶显示玻璃基板激光切割热应力场的有限元仿真  

Finite element simulation of thermal stress field in cutting LCD glass substrate by laser

作　　者：叶圣麟[1] 马军山[1] 黄鑫[2] 王又良[2] 张伟[2] 唐武[2] 

机构地区：[1]上海理工大学光学与电子信息工程学院,上海200093 [2]上海激光所上海市激光束精细加工重点实验室,200233

出　　处：《应用激光》2006年第4期267-271,共5页Applied Laser

基　　金：上海市科学技术委员会(05QMB1424)项目资助

摘　　要：激光切割玻璃基板是一个复杂的激光与材料相互作用的过程。为了掌握切割过程中热应力场的动态分布,提高切割质量,提出了一种热应力场的仿真方法。在有限元软件Ansys环境下,建立了三维液晶显示玻璃基板激光切割热应力场的有限元分析模型。采用间接法方式对温度场和热应力场进行耦合;通过APDL参数化编程语言,实现了对激光移动热源及射流冲击换热模型的仿真。仿真结果表明:在切割过程中,激光照射区内表现为压应力,压应力最大值出现在热源中心处;在激光光斑前、后一段距离内及冷却点附近均表现为拉应力。增大冷却效果及减小冷却点与激光光斑间的距离,均可增大拉应力δy的值。Cutting glass substrate by laser is a complicated process of laser - material interaction. To know the dynamic distribution of thermal stress and to improve the cutting quaility ,a simulation method for thermal stress field is proposed. The three - dimensional finite element analytic model of thermal stress field in laser cutting of LCD substrate is established by using the Ansys software. Temperature field is coupled with thermal stress field by using indirect method. Jet heat transfer and movable heat source are simulated with APDL（ Ansys Parameter Design Language）. The result shows that compressive stress region exists in the field of laser irradiation and the maximum value is in the center of heat source. Tensile stress distribution is near the laser spot as well as cooling point. The value of δy can be increased by enhancing the effect of cooling and decreasing the distance between cooling point and laser spot.

关 键 词：激光切割 热应力场 有限元法 玻璃基板 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]