电化学镀铝基体局域应力对镀层形貌影响研究  

Effects of Substrate Local Strain on Microstructure in Electrodeposition Aluminum Film

作　　者：鄢博[1] 谭月华[2] 高歌[2] 杨玉新[2] 

机构地区：[1]武汉理工大学材料科学与工程学院,武汉430070 [2]新疆大学化学化工学院,乌鲁木齐830046

出　　处：《武汉理工大学学报》2006年第10期42-44,共3页Journal of Wuhan University of Technology

基　　金：国家留学基金委资助项目(2004-2006)

摘　　要：通过电化学方法在带有局域应力的铜表面电镀形成一层铝膜。实验表明沉积在铜表面的铝颗粒形状与局域应力缓释有直接的联系。局域应力越大,形成颗粒越大,形状呈针状。随着局域应力的降低,颗粒度明显降低,颗粒形状逐渐向球形过渡。结果表明基体的局域应力可以改变沉积颗粒的形状,促进沉积颗粒的形核与增长。The aluminum-coating layer was formed on copper substrate with local strain region by using electrodeposition method. It was shown that the particle shape deposited on the copper substrate was very sensitive to the strain extent of substrate. The larger and more needle-like aluminum particles were formed on the substrate region with the lager local strain, indicated that substrate local strain might change the shape of the deposited particles and helped the nucleation and the growth of deposited particles.

关 键 词：电镀 应变能 颗粒形状 

分 类 号：TQ153.1[化学工程—电化学工业]