镀镍溶液中抗多种金属杂质离子添加剂的研究  

Study on Additives Resistant to impurity of metallic ions in Ni Plating Solution

作　　者：左正忠[1] 陈永吉[1] 

机构地区：[1]武汉大学

出　　处：《电镀与环保》1990年第4期1-5,共5页Electroplating & Pollution Control

摘　　要：为了处理被杂质金属离子污染的镀镍溶液,常规的方法有沉淀-过滤法和电解处理法,然而必须停止生产,耗损大量原材料和能源并且造成环境污染。本文提出一种新的方法,在镀镍溶液中加入一种添加剂,例如Fezac(商业名称为881添加剂),经充分搅拌后进行电镀,使杂质金属离子与Ni^(2+)离子产生共沉积并获得优良镀层,从而消除了杂质金属离子的积累并解决了由此而造成的镀液和镀层性能的各种缺陷。用Hull槽试验、小槽电镀和化学分析等获得的结果,证实了使用Fezac添加剂可以消除镍镀液中Cu^(2+)、Fe^(3+)、Al^(3+)、Zn^(2+)、Cr^(3+)等杂质离子所产生的不良影响。由于它不产生沉淀,因而不必过滤也不必停产,减少了处理时问,节约了处理费用。The conventional techniques, such as precipitation, filtration and electrolysis, in treating Ni plating solution contaminated by metallic ions would lead to shutdown, loss of raw materials and energy and causing environmental pollution. In the new method reported here, an additive such as Fezac (Additive 881 as its tradename) is put into the Ni plating solution and fully stirred, and impurity of metallic ions are codeposited with Ni^(2+), resulting in a good deposit, Thus, the buildup of impurity of metallic ions and the resulting drawbacks in plating bath and deposit properties are eliminated. Results from Hull cell test, plating in small tank and chemical analysis show that the use of additive Fezac can get rid of the faults caused by impurity ions such as Cu^(2+), Fe^(3+), Al^(3+), Zn^(3+), and Cr^(3+) in Ni plating bath, Because there exists no precipitate, filtration and shutdown are not needed, and the time and cost for treatment reduced.

关 键 词：镀液 镀镍 添加剂 杂质金属离子 

分 类 号：TQ153.12[化学工程—电化学工业]