镀铜添加剂SH110微观整平性研究  

Investigation on Micro-Levelling Power of Copper Plating additive SH110

作　　者：叶云川 

机构地区：[1]成都国营九七○厂

出　　处：《电镀与精饰》1990年第4期26-30,共5页Plating & Finishing

摘　　要：本文作者用自己发明的"微电极两点法"对镀铜添加剂SH110的整平性进行了测定.揭示了其起整平作用的Kardos机理,实验所得结果对电镀生产实践具有指导意义.Micro- levelling property of copper plating additive SH110 was tested with micro-electrode two point method. The Testing results reveal the mechanism of positive levelling effect of the additive, and are significant to the electroplating production practice.

关 键 词：镀铜 添加剂 SH110 整平性 

分 类 号：TQ153.14[化学工程—电化学工业]