PZT压电厚膜的研究现状与进展  

Status and Progress for Investigation of PZT Piezoelectric Thick Film

作　　者：李传山[1] 沈建兴[1] 张雷[1] 董金美[1] 

机构地区：[1]山东轻工业学院材料科学与工程学院,济南250100

出　　处：《硅酸盐通报》2006年第5期103-107,共5页Bulletin of the Chinese Ceramic Society

基　　金：济南市科学技术发展计划项目(No.046039).

摘　　要：PZT压电厚膜材料具有良好的压电性能,它兼顾了块体材料和薄膜的优点,近年来得到了广泛的研究与应用。本文简述了制备PZT压电厚膜的制备方法及基板、电极材料的研究情况,讨论了目前制造PZT压电厚膜所存在的基板与厚膜之间的高温扩散以及丝网印刷用厚膜浆料难以分散均匀等共性问题,同时,就如何解决这些问题进行了评述。PZT piezoelectric thick film eminent properties which has the merits has been extensively studied and of both the block material and thin widely used recently for its film. The preparation method of PZT piezoelectric thick film and the study of substrate and electrode material were simply reviewed. Besides, the high temperature diffusion between the substrate and the film, and the dispersion of film paste which is used for screen printing method were discussed. Meanwhile, the methods to solve these common problems were pointed out in this paper.

关 键 词：PZT 压电厚膜 浆料 扩散 缓冲层 

分 类 号：TN452[电子电信—微电子学与固体电子学]