钨粉表面化学镀铜研究  

Research of the Electroless Cu Plating on the Surface of Tungsten Powders

作　　者：张振忠[1] 赵芳霞[1] 丘泰[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《铸造技术》2006年第11期1241-1244,共4页Foundry Technology

基　　金：国防科工委研究项目

摘　　要：为了提高钨粉制品的性能,采用正交实验方法,利用SEM、XRD、EDS等分析手段,系统研究了化学镀铜主要工艺参数对钨粉表面化学镀铜的影响规律。结果表明:在温度固定条件下,各因素对镀液稳定性影响的显著性顺序是:硫代硫酸钠加入量>pH值>χ(Tar2-/Cu2+)>甲醛加入量,而对镀速影响的显著性顺序是:χ(Tar2-/Cu2+)>pH值>甲醛加入量>硫代硫酸钠加入量;较佳的钨粉表面化学镀铜工艺为:五水硫酸铜8g/L;酒石酸钾钠28g/L;EDTA0.75g/L;NaOH8.5g/L;硫代硫酸钠10mg/L;甲醛7.5ml/L;pH=12;温度40℃。采用所推荐的工艺,成功的在钨粉上获得了化学镀铜层。The effect of the main process parameters on the electroless Cu plating on the surfaces of the tungsten powders were systematically studied in this paper for developing high performance products contenting tungsten by the orthogonal experiment and the means of SEM, XRD, EDS, and so on. The results showed that. When the temperature was fixed, the significance influence on the solution stability of the electroless Cu plating of the factors decreased according to the order： the concentration of hyposulphite〉 pH〉 x （Tar^2-/Cu^2＋ ） 〉 the concentration of formaldehyde, but the significance influence on the plating rate of the factors decreased according to the order： x（Tar^2- / Cu^2＋） 〉 pH〉the concentration of formaldehyde〉the concentration of hyposulphite . The better electroless processing was proposed as follows： CuSO4.5H2O. of 8 g/L, KNaC4H4O6 · 4H2O of 28 g/L, EDTA of 0.75 g/L, NaOH of 8.5 g/L, hyposulphite of 10 mg/L, formaldehyde of 7.5 ml/L, pH value of 12 and the plating temperature about 40℃. Under this optimum conditions of the scheme, the Cu electroless platings were successfully prepared on the surfaces of the tungsten powders.

关 键 词：钨粉 化学镀铜 镀液稳定性 施镀工艺 

分 类 号：TQ153.14[化学工程—电化学工业]