喷射电铸快速制造的试验研究  

Experimental Research on Jet Electroforming Oriented by Rapid Manufacturing

作　　者：陈劲松[1] 黄因慧[1] 刘志东[1] 田宗军[1] 赵阳培[1] 

机构地区：[1]南京航空航天大学机电学院,江苏南京210016

出　　处：《华南理工大学学报（自然科学版）》2006年第11期16-19,24,共5页Journal of South China University of Technology(Natural Science Edition)

基　　金：国家自然科学基金资助项目(50175053);江苏省自然科学基金重点项目(BK2004005)

摘　　要：介绍了喷射电铸快速制造技术的原理与系统组成,采用喷射电铸快速制造工艺制备了具有简单形状的纳米晶金属铜样件,运用扫描电子显微镜和X-射线衍射等现代分析手段对纳米晶微观结构进行分析.结果表明,喷射电铸能显著提高极限电流密度,细化晶粒,改善铸层质量.铜沉积层具有纳米晶微观结构,平均晶粒尺寸约为55.6 nm,最小晶粒尺寸可达41.4 nm.The principles and system components of the jet electroforming orientated by rapid manufacturing were introduced, and some nanocyrstalline copper parts with simple shapes were fabricated by the introduced technology. SEM and XRD were then used to analyze the microstructure of the nanocrystalline. The results show that the jet electroforming greatly increases the ultimate current density, fines crystalline particles and improves the deposition quality. Moreover, the deposited copper layers are all of nanocrystalline microstructure, with an average size of 55.6nm and a minimum size of 41.4nm.

关 键 词：喷射 电铸 快速制造 纳米晶 微观结构 电流密度 

分 类 号：TG623[金属学及工艺—金属切削加工及机床]