LTCC多层微波传输线的性能优化研究  

Optimization of Performances of Microwave Transmission Lines on LTCC Multilayer Substrate

作　　者：姜伟卓[1] 符鹏[1] 王锋[1] 

机构地区：[1]南京电子技术研究所,江苏南京210013

出　　处：《电子机械工程》2006年第6期45-48,共4页Electro-Mechanical Engineering

摘　　要：采用LTCC技术制造的多层基板是高密度微波多芯片组件的关键部件,其多层微波传输线的性能将直接影响组件的性能。对LTCC多层基板中微带线、带状线及其互连过渡结构的性能进行了仿真,通过优化接地通孔的设置,有效地抑制了谐振,扩展了应用的频率范围。LTCC multilayer substrate is the key element of high - density MMCM （ microwave multi-chip module）. The performance of the module is significantly influenced by multilayer microwave transmissi The microstfipline, stfipline and the transition between them are simulated and optimized by changing ring of grounding vias. The resonance is decreased effectively and the frequency band is widened. on line. the setting of grounding vias. The resonance is decreased effectively and the frequency band is widened.

关 键 词：LTCC 多层微带线 多层带状线 互连过渡 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]