超细铜粉制备过程中的粒度分布行为研究  

STUDIES ON THE CSD BEHAVIOUR OF THE ULTRAFINE COPPER POWDER PREPARATION

作　　者：黄锡文[1] 葛庆仁[1] 谢振风[1] 

机构地区：[1]天津大学化学工程系

出　　处：《化学反应工程与工艺》1996年第4期419-423,共5页Chemical Reaction Engineering and Technology

基　　金：国家自然科学基金

摘　　要：考察了不同制备条件对超细铜粉形成过程的影响。结果表明，随着平均停留时间减小，粒度变小，分布变窄；高的进料液浓度或较高温度下形成的粒子发生了“粒级凝聚”或“核级凝聚”。表面活性剂有显著的防凝作用。在适度晶核泛溢情况下，粒径分布符合粒子数平衡理论所预言的分布规律。The effects of temperature, mean residence time, feed concentration and surfactant on the ultrafine copper powder formation process in a mixed suspension reactor were investigated. The results showed that a smaller particle size and narrower size distribution could be obtained by reducing the mean residence time, and serious agglomeration occurred in the regions of high feed concernation and high reaction temperauture, which might be called “interparticle agglomeration” and “internucleus agglomeration” respectively. Surfactant was added into the solution to reduce the agglomeration effectively. The CSD behaviour of formation process was in agreement with the population balance theory under the condition of “proper crystal nucleus overflow”.

关 键 词：铜粉 表面活性剂 粒子数平衡 超细粉末 粒度分布 

分 类 号：TQ029.1[化学工程] TQ131.21