纳米多孔二氧化硅绝热薄膜的研究进展  

Development of nanoporous silica thermal insulating films

作　　者：赵宗彦[1] 柳清菊[1] 张瑾[1] 朱忠其[1] 

机构地区：[1]云南大学材料科学与工程系,云南昆明650091

出　　处：《功能材料》2006年第12期1859-1863,共5页Journal of Functional Materials

基　　金：教育部新世纪优秀人才支持计划资助项目(NCET-04-0915)

摘　　要：作为微电子机械系统(MEMS)技术中最有潜力的绝热材料,纳米多孔二氧化硅薄膜近年来引起了广泛的关注。研究表明其绝热性能与微观结构密切相关。综述了纳米多孔二氧化硅薄膜的制备方法、表征手段和绝热机理,并讨论了目前存在的一些问题和今后的发展方向。As the most potential thermal insulating material in the MEMS technology, nanoporous silica film has attracted widespread attention. The research has indicated that its property of thermal insulation is directly related to its microstructure. This paper has summarized the advances in preparation, characterization and thermal insulating mechanism. Finally, the present problems and development direction in the future were pointed out.

关 键 词：纳米多孔二氧化硅薄膜 绝热材料 绝热机理 

分 类 号：O484.4[理学—固体物理]