圆片级封装技术  

Wafer-Level Packaging Technology

作　　者：童志义[1] 

机构地区：[1]中电科技集团第四十五研究所,北京东燕郊065021

出　　处：《电子工业专用设备》2006年第12期1-6,共6页Equipment for Electronic Products Manufacturing

摘　　要：圆片级封装(Wafer-LevelPackaging,WLP)已成为先进封装技术的重要组成部分,圆片级封装能够为芯片封装带来批量加工的规模经济效益。在圆片规模上开始加工,结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。圆片级封装加工将成为业界前端和后端之间的高性能衔接桥梁。综述了圆片级封装的技术及其发展趋势。Wafer-Level Packaging （WLP） technology has become the important composition of advanced packaging technology, which is able to produce economic benefits of scale in batch process for die packaging. The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP. WLP process technology will become a high performs technology bridge in IC industry between front end and back end process. In this paper, WLP technologies and its development trend are introduced.

关 键 词：圆片级封装 薄膜再分布技术 焊料凸点技术 厚胶光划 发展趋势 

分 类 号：TN305.94[电子电信—物理电子学]