大功率白光LED封装设计与研究进展  

Advances in Packaging Design and Research on High-power White LED

作　　者：陈明祥[1] 罗小兵[2] 马泽涛[1] 刘胜[1] 

机构地区：[1]华中科技大学微系统研究中心,湖北武汉430074 [2]武汉光电国家实验室微光机电系统部,湖北武汉430074

出　　处：《半导体光电》2006年第6期653-658,共6页Semiconductor Optoelectronics

基　　金：湖北省2005年科技攻关计划招标项目(2006AA103A04)

摘　　要：封装设计、材料和结构的不断创新使发光二极管(LED)性能不断提高。从光学、热学、电学、机械、可靠性等方面,详细评述了大功率白光LED封装的设计和研究进展,并对封装材料和工艺进行了具体介绍。提出LED的封装设计应与芯片设计同时进行,并且需要对光、热、电、结构等性能统一考虑。在封装过程中,虽然材料(散热基板、荧光粉、灌封胶)选择很重要,但封装工艺(界面热阻、封装应力)对LED光效和可靠性影响也很大。Innovative designs, materials and structures of packaging have led to dramatic improvements of the performances in LED technology, The rapid progresses in packaging design and research of high-power white light emitting diodes （LEDs） have been overviewed. The packaging design of LED has been summarized in the view of optics, thermology, electrics, mechanics and reliability, and the packaging material and processes have been introduced in detail. It is proposed that packaging and chip of LED should be co-designed, and the effect of optical, thermal, electrical and mechanical should be considered at the same time. Although it is important to choose packaging materials （ such as thermal spreading substrate, phosphors and silicone）, the interface thermal resistance and thermal stress resulting from packaging processes have greater effect on the luminous efficiency and reliability of packaged LED.

关 键 词：固态照明 大功率LED 白光LED 封装 

分 类 号：TN305.94[电子电信—物理电子学]