玻璃表面化学镀纳米铜膜  

Electroless plating nanocrystalline Cu film on glass substrate

作　　者：张会平[1] 江中浩[1] 刘先黎[1] 连建设[1] 侯旭峰[2] 李光玉[1] 

机构地区：[1]吉林大学汽车材料教育部重点实验室,长春130022 [2]吉林北方彩晶数码电子有限公司,长春130033

出　　处：《吉林大学学报（工学版）》2007年第1期11-16,共6页Journal of Jilin University:Engineering and Technology Edition

基　　金：'973'国家重点基础研究发展计划项目(2004CB619301);吉林大学'985'工程资助项目;吉林大学创新基金资助项目(419170200014)

摘　　要：利用化学镀铜工艺，以十二烷基苯磺酸钠（SDBS）作为镀液添加剂，在未经刻蚀的玻璃表面制备了纳米铜膜。采用FESEM、SEM和XRD等技术对铜膜表面、断面形貌及晶体结构进行了表征。结果表明，铜膜内团簇尺寸非常细小，晶粒尺寸约为15．5～28．3nm，且存在较强的〈111〉织构。采用四探针法测量铜膜的电阻率，并讨论了电阻率随沉积时间增加而逐渐下降的原因。Nanocrystalline Cu films were prepared on an unetched glass substrate by an electroless plating technique with using Sodium Dodecyl Benzene Sulfonate （SDBS） as an additive in the bath. The morphologies of surface and cross-section and crystalline structure were characterized by FESEM, SEM and XRD. Experimental results show that the nodules in the Cu films are pretty fine, the grain size ranges from 15.5 nm to 28.3 nm, and an enhanced 〈111〉 texture existes in the Cu films. The resistivity of the Cu films was examined by four-point probe method. The reason that the resistivity of the Cu films decreases with the increase of the deposition time was discussed.

关 键 词：材料表面与界面 化学镀 纳米铜膜 电阻率 玻璃基体 

分 类 号：TG174.4[金属学及工艺—金属表面处理]