Ti/Ag/Cu活性焊料的封接特性  

Jointing Characteristics of Ti/Ag/Cu Active Solder

作　　者：金大志[1] 彭康[1] 曾敏[1] 解永蓉[1] 邹桂娟[1] 黄晓军[1] 

机构地区：[1]中国工程物理研究院电子工程研究所

出　　处：《真空电子技术》2006年第4期59-61,共3页Vacuum Electronics

摘　　要：Ti/Ag/Cu活性焊料法广泛应用于陶瓷与金属的焊接中,但该焊料在陶瓷表面的浸润性较差,在金属表面易发生偏析的现象。本文对该焊料的流散特性进行了讨论,对陶瓷与金属的封接界面进行了分析,对封接机理进行了讨论,结果表明在封接界面生成Ti的氧化物主要是TiO2。Ti/Ag/Cu active jointing is widely applied in jointing of ceramic/metal. Unfortunately, the soakage of this solder on ceramic is not quite satisfied, and it spreads on metal asymmetricly. In the paper, the spreading characteristics of this solder are discussed and the jointing interfaces are analyzed. The mechanism of the jointing is discussed too. The results indicate that the oxide of Ti produced in the jointing interface is mostly TiO2.

关 键 词：Ti/Ag/Cu活性焊料 陶瓷/金属 封接 

分 类 号：TG425[金属学及工艺—焊接]