一种挠性印制电路基板的研制  

Preparation of flexible printed circuits board

作　　者：王劲[1] 唐屹[1] 曾晓丹[1] 王剑[1] 谢美丽[1] 

机构地区：[1]高分子材料工程国家重点实验室四川大学高分子科学与工程学院,四川成都610065

出　　处：《电子元件与材料》2007年第2期34-36,共3页Electronic Components And Materials

基　　金：国家"863"子课题资助项目(2001AA334020-1)

摘　　要：以脂肪族二胺、芳香杂环二胺和芳香四羧酸二酐或芳香四羧酸二酐、芳香族二胺为原料,N-甲基吡咯烷酮为溶剂,合成两种聚酰胺酸。逐层涂覆,制备了表面为热可塑聚酰亚胺的三层聚酰亚胺复合膜,与铜箔热压复合制备了双面覆铜挠性印制电路基板。热塑性聚酰亚胺胶的玻璃化转变温度为133℃,三层聚酰亚胺复合膜的结晶熔融温度为222℃。该挠性印制电路基材平均剥离强度为7.1 N/cm。Two kinds of polyamic acids （PAA） were prepared by aliphatic diamine, aromatic diamine and aromatic dianhydride in NMP （N-methyl pyrrolidone）. The PAA solution was cast one by one and thermal-imidized. On the basis of this procedure, three-layer polyimide films were prepared with thermoplastic polyimide on the surface layer. Double-sided FCCL （flexible copper clad laminates） was prepared by hot-pressing with copper foils. The results shown for thermoplastic polyimide film, the glass transition temperature is 133 ℃, the crystal melt temperature of threelayer polyimide film is 1222℃. The mean peel strength of FCCL between polyimide films and copper foils is 7.1 N/cm.

关 键 词：电子技术 挠性印制电路(HPC) 热可塑聚酰亚胺 结晶 

分 类 号：TN604[电子电信—电路与系统]