全自动划片机的关键技术研究  

Study on Key Technologies of Full Auto Dicing Saw

作　　者：王明权[1] 王宏智[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京东燕郊101601

出　　处：《电子工业专用设备》2007年第2期28-32,38,共6页Equipment for Electronic Products Manufacturing

摘　　要：根据微电子工业的发展现状,论述发展全自动划片机的必要性;从全自动划片机的工作机理出发,分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术;依据分析结果提出相应的解决措施。The necessity of developing full auto dicing saw is discussed according to development status of microelectronic industry. The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed. According to the analytic result, measures were put forward to solve problems.

关 键 词：空气静压电主轴 晶圆传输定位 自动对准 自动清洗 

分 类 号：TN305.2[电子电信—物理电子学]