聚苯乙烯包覆环氧树脂微胶囊的研制  

Development of PS Coated Epoxy Resin Microcapsule

作　　者：谢建强[1] 梁国正[1] 袁莉[1] 张增平[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710072

出　　处：《塑料工业》2007年第3期64-67,共4页China Plastics Industry

摘　　要：以环氧树脂和稀释剂环氧丙烷丁基醚为囊芯，苯乙烯-二乙烯基苯为高分子囊壁材料，采用原位聚合法合成了一种全新的自修复微胶囊-聚苯乙烯包覆环氧树脂微胶囊。考察了不同种类与不同用量的乳化剂对囊芯与壁材溶液进行乳化以及反应温度、反应时间、引发剂添加方式等对聚苯乙烯包覆环氧树脂与活性稀释剂微胶囊合成工艺的影响。结果表明：实验成功合成了聚苯乙烯包覆环氧树脂微胶囊，最佳工艺条件为采用1％阿拉伯树胶作为乳化剂，先加入BPO引发反应5h后再加入过硫酸钾，反应温度在70～80℃，反应时间8h。With epoxy matrix and the dilution of the matrix as core materials, St/DVB as capsule shell material, a novel PS coated epoxy resin self-mending microcapsule was prepared by means of in-situ polymerization. The effects of different kind and content of emulsifier on the emulsification of the core materials and shell material, the effects of the reaction temperature and time, as well as the effect of the loading method of initiator, on the synthesis process of the microcapsule were studied. The results showed PS coated epoxy resin microcapsule was successfully synthesized, and the optimum process conditions were that 1% Arabic gum was used as emulsifier, BPO was used to initiate the reaction, then KPS was loaded 5 h after the initiation, the reaction temperature was 70 -80℃, and the reaction time was 8 h.

关 键 词：微胶囊 聚苯乙烯 环氧树脂 原位聚合 

分 类 号：TQ320.6[化学工程—合成树脂塑料工业]