点胶球形阵列封装组件机械弯曲可靠性研究  

Mechanical bend Reliability of Ball Grid Array Assembly with Underfill

作　　者：齐芳娟[1] 王建强[1] 郑天群[2] 

机构地区：[1]石家庄铁道学院材料科学与工程系 [2]四川大学材料科学与工程学院

出　　处：《中国集成电路》2007年第3期63-67,共5页China lntegrated Circuit

摘　　要：本文对比了两组经不同材料充胶的BGA组件和一组未充胶BGA组件在机械弯曲中的可靠性,包括三点弯试验和机械弯曲疲劳试验。结果发现在机械弯曲可靠性试验中,U1、U2材料的填充均能提高焊点的机械弯曲可靠性,并且U1的效果更好。通过对试样剖面显微观察,发现在用U1充胶的样品中,失效发生在焊点、PCB板处;而在其它两组样品中,失效发生在焊点、PCB板和铜焊盘三处。In this paper, three groups of BGA assemblies are investigated and compared in mechanical bend fatigue test and three point bend test, they are without underfill material, with U1 material, with U2 material, respectively. The results show that, in the mechanical bend fatigue test and three point bend test, the underfill material of U 1 and U2 both can improve the mechanical bend reliability of BGA assemblies, and U 1 material performs better. Through the optical microscope, cracks can be found in solder and PCB material in the BGA assemblies with U1 material. In the other two groups, the cracks can be found in solder, copper pad, and PCB material.

关 键 词：点胶 机械弯曲可靠性 三点弯试验 机械弯曲疲劳 

分 类 号：TN405[电子电信—微电子学与固体电子学]