机械合金化对Mo-Cu合金性能的影响  

Effect of mechanical alloying on the property of Mo-Cu alloy

作　　者：周贤良[1] 饶有海[1] 华小珍[1] 张建云[1] 邹爱华[1] 

机构地区：[1]南昌航空工业学院材料科学与工程学院,南昌330034

出　　处：《粉末冶金技术》2007年第1期21-23,共3页Powder Metallurgy Technology

基　　金：江西省教育厅科技项目资助(赣教字166号)

摘　　要：研究了机械合金化对电子封装用Mo-Cu合金性能的影响规律,结果表明:经机械合金化处理后,钼铜粉末完全变形,颗粒成层片状,小颗粒明显增多,并黏附在大颗粒上面,有的小颗粒到达纳米级,且粉末的衍射峰宽化,衍射峰强度下降。机械合金化后,在不同温度下烧结的Mo-30Cu合金的相对密度、硬度、电导率和热导率都较高,而混合法的较差;当烧结温度在1050～1250℃之间时,合金的相对密度、硬度、电导率和热导率随着温度的上升而增大。当温度大于1250℃时,变化不大。The effect of mechanical alloying on the property of Mo-Cu alloy for electronic packaging was studied. It is found that the molybdenum and copper powder particles get totally out of shape and become flaky after mechanical alloying, the tiny particles are obviously increased in number and stuck on the big particles. Tiny particle size is in the range of nanometer. The diffraction peaks of the molybdenum and copper after the mechanical alloying become wider and the intensity of diffraction peaks drop. After the mechanical alloying, the density, hardness, electric and thermal conductance of the Mo-30Cu alloy sintered at different temperature are comparatively higher than that of mixed one. The density, hardness, electric and thermal conductance of the Mo-30Cu alloy increase with the temperature increased until 1 250℃ .

关 键 词：机械合金化 Mo-Cu 性能 

分 类 号：TQ174.758[化学工程—陶瓷工业]