Sn-Cu系无铅钎料的研究现状与发展  

Research status and development of Sn-Cu based solder

作　　者：史益平[1] 薛松柏[1] 王俭辛[1] 顾荣海[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,210016

出　　处：《焊接》2007年第4期14-18,共5页Welding & Joining

摘　　要：介绍了无铅钎料应用时应该满足的基本要求和Sn-Cu系无铅钎料的国内外研究和应用现状,概述了Sn-Cu系无铅钎料润湿性能、物理性能、力学性能等方面的一些特点,分析探讨了Sn-Cu系无铅钎料存在的不足,详细阐述了添加不同合金元素(如Bi、Ag、Ni、RE等元素)对Sn-Cu系无铅钎料性能的影响规律,并对Sn-Cu系无铅钎料的应用前景和发展方向进行了展望。The requirements of lead-free solder applied to soldering and the research and application status of Sn-Cu based solder were introduced at home and abroad. The wettability, physical property and mechanical property of Sn-Cu based solder were summarized, and some existing problems about Sn-Cu based solder were also analyzed and discussed briefly. The influence of different elements (including Bi, Ag, Ni, RE, etc. ) on properties of Sn-Cu based solder was reviewed in detail, and at the same time, the perspective of development and application of Sn-Cu solder was previewed constructively.

关 键 词：无铅钎料 Sn—Cu 润湿性能 力学性能 

分 类 号：TG454[金属学及工艺—焊接]