喷射成形电子封装Si-Al合金凝固过程模拟研究  

Simulation of Solidification Behavior in Spray-deposited Si-Al Preforms Used for Electronic Packaging Materials

作　　者：尧军平[1] 杨滨[2] 张磊[1] 陈美英[2] 张济山[2] 

机构地区：[1]南昌航空工业学院材料科学与工程学院,江西南昌330063 [2]北京科技大学新金属材料国家重点实验室,北京100083

出　　处：《铸造技术》2007年第3期389-392,共4页Foundry Technology

基　　金：江西省自然科学基金项目(CA200500100)

摘　　要：为了优化喷射成形Si-Al合金成形工艺,获得优良的显微组织,本文模拟了喷射成形Si-30wt%Al合金的凝固过程,研究了雾化压力和沉积距离对熔滴冷却过程中的温度和固相分数的影响。模拟计算结果表明,部分优化的工艺参数为:雾化压力0.8 MPa,沉积距离600 mm。该工艺条件下,固相分数可达70%。实验证实,采用该工艺参数易于获得均匀、细小的Si颗粒组织。To optimize the spray forming process and obtain desired Si-Al perform microstructures, it is essential to make a full understanding of the solidification process of the alloys. In this study, a numerical simulation of solidification behavior for spray-deposited Si-30wt% Al performs has been calculated and discussed. The 0.8MPa atomization pressure and 600mm axial distance are showed the partly optimized parameters and the solid fraction is more than 7%, and under this parameter condition uniform and tiny si particle organizations can be got.

关 键 词：喷射成形 电子封装 Si-Al合金 凝固分析 

分 类 号：TG27[金属学及工艺—铸造]