镀银铜粉导电电子浆料的研究  

Study on Silver Plating Copper Powder Electro-conductive Paint

作　　者：彭舒[1] 唐振方[1] 周序乐[1] 

机构地区：[1]暨南大学物理系,广州510632

出　　处：《科学技术与工程》2007年第9期1868-1871,共4页Science Technology and Engineering

摘　　要：研究了以镀银铜粉为导电填料的电子浆料,讨论了镀银铜粉含量、硅烷偶联剂的用量以及处理方法对导电浆料导电性能的影响。结果表明,当镀银铜粉填充含量达75%,偶联剂含量3%时,导电浆料的导电性、分散性、稳定性等性能较好。A composite conductive paint based on silver plating copper powder and epoxy resin was developed, and the effects of silver plating copper powder and coupling agent on the conductivity of paint were discussed. The results showed that the conductive properties of paint was the best when the amount of silver plating copper powder and coupling agent, 75% and 3 %, respectively. Compared with copper conductive adhesive, it has better stability and depersion.

关 键 词：导电浆料 镀银铜粉 偶联剂 环氧树脂 

分 类 号：TM241[一般工业技术—材料科学与工程]