激光微加工对陶瓷表面化学镀铜的影响研究  

Effect of Laser Micro-Processing on Electroless Plating of Copper on Ceramics

作　　者：沈艺程[1] 续振林[2] 辜志俊[1] 姚元根[1] 

机构地区：[1]中国科学研究院福建物质结构研究所,福建福州350002 [2]中国科学研究院研究生院,北京100039

出　　处：《材料保护》2007年第4期17-18,27,共3页Materials Protection

摘　　要：采用扫描电镜(SEM)、X射线光电子谱(XPS)、X射线衍射能谱仪(XRD)等手段比较激光微加工处理前后陶瓷表面形貌发生的变化,探讨了激光微处理在陶瓷表面无敏化活化化学镀铜工艺中的作用。结果表明,陶瓷基底经激光处理后,其表面成分并未发生改变,但其表面活性增强,从而促进了化学镀铜反应的进行。The effect of laser micro-processing on the electroless plating of copper on ceramic substrate was investigated.Thus the morphologies and microstructures and compositions of the ceramics before and after laser micro-processing were investigated by means of scanning electron microscopy,X-ray photoelectron spectroscopy,and X-ray diffraction.The action of laser micro-processing in the sensitization-and activation-free electroless plating of copper for ceramics was discussed.It was found that laser micro-processing led to no obvious changes in the composition of the ceramic surface but increased the activity of the ceramic surface,which contributed to enhancing the electroless copper plating of the ceramic substrate.

关 键 词：化学镀铜 陶瓷 激光微加工 

分 类 号：TQ153.14[化学工程—电化学工业]