ABS塑料化学镀铜工艺  

Technology of electroless copper plating on ABS plastics

作　　者：余晓皎[1] 张洵亚[1] 范薇[2] 余中[1] 

机构地区：[1]西安理工大学理学院,水利水电学院,陕西西安710048 [2]开封大学化学化工学院,河南开封475004

出　　处：《电镀与涂饰》2007年第5期10-12,共3页Electroplating & Finishing

摘　　要：介绍了ABS塑料表面化学镀铜的工艺流程，讨论了粗化温度和时间，敏化和活化时间、硫酸铜质量浓度、甲醛体积浓度、酒石酸钾钠质量浓度、镀液温度和镀液pH对镀层质量以及化学镀铜沉积速率的影响。确定了最佳工艺条件为15～20g／L硫酸铜、15mL／L甲醛、14g／L酒石酸钾钠，镀液温度为323K，镀液的pH为11～12。扫描电镜表明，所得镀层均匀、光亮，结合力好。The process flow of electroless copper plating on ABS plastics was introduced, and the effects of roughening temperature and time, sensitizing and activating time, contents of copper sulfate, formaldehyde, potassium sodium tartrate, temperature and solution pH on electroless plating rate and qualities of electroless plating layer were discussed. The optimal technological conditions of electroless copper deposition are determined as follows： 15～20 g/L copper sulfate, 15 mL/L formaldehyde, 14 g/L potassium sodium tartrate, temperature 323 K and pH of plating solution 11～12. The SEM photo shows that the plating layer is even and bright and has good adhesion.

关 键 词：ABS塑料 化学镀铜 工艺条件 

分 类 号：TG178[金属学及工艺—金属表面处理]