金刚石化学镀铜工艺研究  

Study on process of electroless plating copper on diamond

作　　者：侯亚平[1] 易丹青[1] 李荐[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《电镀与涂饰》2007年第5期16-19,27,共5页Electroplating & Finishing

摘　　要：介绍了金刚石化学镀铜工艺流程、工艺配方。研究了不同络合剂体系对镀液稳定性以及不同预处理方法对化学镀铜层表面形貌的影响。探讨了硫酸铜质量浓度、络合剂物质的量之比和不同pH下甲醛质量浓度对金刚石表面沉积铜速率的影响。结果表明:使用胶体钯敏化活化能显著提高金刚石表面镀铜质量,多元络合剂的加入可以增加镀液的稳定性。获得了化学镀铜最佳工艺条件:CuSO4·5H2O15g/L,甲醛(w(HCHO)=36%)15g/L,酒石酸钾钠14g/L,EDTA14.6g/L,NaOH适量,二联吡啶0.02g/L,亚铁氰化钾0.01g/L,温度(43±0.5)°C,pH=12.5。采用此工艺在金刚石颗粒表面获得了良好的镀铜层。The process flow and formula of electroless copper plating on diamond was introduced. The influence of different complexant systems on bath＇s stability, and pretreatment methods on surface morphology of electroless copper plating deposit was studied. The influence of mass concentration of cupric sulfate, molar ratio of complexant of EDTA to sodium potassium tartrate and mass concentration of formaldehyde at different pH value on copper deposition rate was discussed. Results show that the quality of copper plated on diamond was improved obviously using colloidal Pd sensitizing and activating. Bath＇s stability is increased by adding the double complexants. The optimal technics condition was obtained as flows： ρ（CuSo4.5H2o） 15 g/L, ρ（formaldehyde） （mass fraction of 36%） 15 g/L, ρ（sodium potassium tartrate） 14 g/L, ρ（EDTA） 14.6 g/L, ρ（bipyfidyl） 0.02 g/L, ρ（potassium ferrocyanide） 0.01 g/L, temperature （43±0.5）℃ and pH 12.5. Good copper deposit layer was gained on the diamond particle surface using the technics.

关 键 词：金刚石 化学镀铜 工艺 沉积速度 

分 类 号：TG178[金属学及工艺—金属表面处理] TQ153[金属学及工艺—金属学]