无氰化学镀金技术的发展及展望  

Development and Prospect of Non-cyanide Electroless Gold Plating

作　　者：刘海萍[1] 李宁[1] 毕四富[1] 孔令涛[2] 李康[2] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001 [2]哈尔滨工业大学(威海)海洋学院化学工程与工艺,山东威海264209

出　　处：《电镀与环保》2007年第3期4-7,共4页Electroplating & Pollution Control

摘　　要：综述了化学镀金的研究进展。详细阐述以亚硫酸钠及硫代硫酸钠为配位剂的无氰化学镀金的研究及发展现状。同时介绍了用于印刷线路板(PCB)的置换镀金工艺现状及前景,以期对无氰化学镀金的研究现状及未来发展有更好的了解。The progress in research on non-cyanide electroless gold plating is reviewed. The research and status of non-cyanlde electroless gold plating using sodium sulfite and/or hyposulphite as complexing agent are described in detail. The status and prospect of immersion gold plating in PCB are presented as well. The purpose is for a better understanding of the present level and future development of non-cyanide electroless gold plating.

关 键 词：无氰 化学镀金 配位剂 亚硫酸钠 

分 类 号：TQ153[化学工程—电化学工业]